Abstract

ARANEDA-HERNANDEZ, Eugenia; VERGARA-GUTIERREZ, Froilán  and  PAGLIERO-NEIRA, Antonio. Effect of additives on diffusion coefficient for cupric ions and kinematics viscosity in CuSO₄-H₂SO₄ solution at 60°C. Dyna rev.fac.nac.minas [online]. 2014, vol.81, n.188, pp.209-215. ISSN 0012-7353.  https://doi.org/10.15446/dyna.v81n188.41815.

The effect of levelling and grain-refining agents on the diffusion coefficient of cupric ion was studied. Tests were performed using synthetic solutions with Cu²⁺ concentration and acidity similar to those of a copper electro-refining industrial electrolyte by means of rotating disc electrode (RDE) technique. The diffusion coefficient was calculated according to Levich's expression from measurements of limiting current for different rotating speed of the RDE. Arrhenius dependence of the diffusion coefficient with temperature in the absence of additives was verified. In presence of additives, the variation of the limiting current is mainly attributed to changes in diffusion coefficient of cupric ion observed.

Keywords : diffusion coefficient cupric ions; electrorefining copper; glue; thiourea; chloride.

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