<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>1794-9165</journal-id>
<journal-title><![CDATA[Ingeniería y Ciencia]]></journal-title>
<abbrev-journal-title><![CDATA[ing.cienc.]]></abbrev-journal-title>
<issn>1794-9165</issn>
<publisher>
<publisher-name><![CDATA[Escuela de Ciencias y Humanidades y Escuela de Ingeniería de la Universidad EAFIT]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S1794-91652019000200101</article-id>
<article-id pub-id-type="doi">10.17230/ingciencia.15.30.5</article-id>
<title-group>
<article-title xml:lang="es"><![CDATA[Medición de la conductividad térmica en materiales aislantes bajo régimen de flujo de calor no estacionario]]></article-title>
<article-title xml:lang="en"><![CDATA[Thermal Conductivity Measurement of Insulating Materials Under Non-stationary Heat Flow]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Daza-Mafioli]]></surname>
<given-names><![CDATA[C. M.]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Coral-Escobar]]></surname>
<given-names><![CDATA[E. E.]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Plaza-Castillo]]></surname>
<given-names><![CDATA[J.]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
</contrib-group>
<aff id="Af1">
<institution><![CDATA[,Universidad del Atlántico  ]]></institution>
<addr-line><![CDATA[Barranquilla ]]></addr-line>
<country>Colombia</country>
</aff>
<aff id="Af2">
<institution><![CDATA[,Universidad del Atlántico  ]]></institution>
<addr-line><![CDATA[Barranquilla ]]></addr-line>
<country>Colombia</country>
</aff>
<aff id="Af3">
<institution><![CDATA[,Universidad del Atlántico  ]]></institution>
<addr-line><![CDATA[Barranquilla ]]></addr-line>
<country>Colombia</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>12</month>
<year>2019</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>12</month>
<year>2019</year>
</pub-date>
<volume>15</volume>
<numero>30</numero>
<fpage>101</fpage>
<lpage>116</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://www.scielo.org.co/scielo.php?script=sci_arttext&amp;pid=S1794-91652019000200101&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.co/scielo.php?script=sci_abstract&amp;pid=S1794-91652019000200101&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.co/scielo.php?script=sci_pdf&amp;pid=S1794-91652019000200101&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="es"><p><![CDATA[Resumen Se desarrolló un dispositivo para medir la conductividad térmica en materiales sólidos para aislamiento térmico de uso común en edificaciones, siguiendo un modelo unidimensional de flujo de calor que atraviesa una placa del material a evaluar. Se mide el gradiente de temperatura entre las caras de la placa en función del tiempo, usando un arreglo diferencial de termopares tipo T. Para el control de los mecanismos del instrumento, la adquisición y tratamiento de los datos, se diseñó un circuito con microcontroladores comerciales. En ensayos previos con algunos materiales, se obtuvieron valores la conductividad térmica similares a los reportados en la literatura utilizando un ajuste lineal con valores de R entre 0.90 y 0.98. El dispositivo obtenido respresenta un instrumento útil para la medición de la conductividad térmica, destacando entre sus ventajas: la fácil construcción, el tamaño de las muestras a evaluar y el método de medida, comparado con los métodos tradicionales para medir este parámetro.]]></p></abstract>
<abstract abstract-type="short" xml:lang="en"><p><![CDATA[Abstract A device to measure thermal conductivity in thermal insulating solid materials commonly used in buildings was developed following a one-dimensional model of heat flow through a plate of the material to be evaluated. The temperature gradient between the plate faces was measured as a function of time by means of a set of type T thermocouples. A circuit with commercial microcontrollers was designed to control the instrument&#8217;s mechanisms, the acquisition and the treatment of data. In preliminary tests with some materials, thermal conductivity values similar to those reported in the literature were obtained by using a linear adjustment with R values between 0.90 and 0.98. This device turns out to be a good instrument for measuring thermal conductivity because it has several advantages, such as: easy implementation, sample size, measurement method; compared to those using traditional methods.]]></p></abstract>
<kwd-group>
<kwd lng="es"><![CDATA[Conductividad térmica]]></kwd>
<kwd lng="es"><![CDATA[flujo de calor]]></kwd>
<kwd lng="es"><![CDATA[aislantes térmicos]]></kwd>
<kwd lng="es"><![CDATA[incertidumbre]]></kwd>
<kwd lng="es"><![CDATA[consumo energético]]></kwd>
<kwd lng="es"><![CDATA[construcción de edificaciones]]></kwd>
<kwd lng="en"><![CDATA[Thermal conductivity]]></kwd>
<kwd lng="en"><![CDATA[heat flow]]></kwd>
<kwd lng="en"><![CDATA[thermal insulator]]></kwd>
<kwd lng="en"><![CDATA[uncertainty]]></kwd>
<kwd lng="en"><![CDATA[energy consumption]]></kwd>
<kwd lng="en"><![CDATA[building construction]]></kwd>
</kwd-group>
</article-meta>
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